Structural health monitoring of solder joints in QFN package

Keyphrases

• Aerospace 33%
• Crack Propagation 66%
• Electrical Performance 33%
• High Power 33%
• Mathematical Model 33%
• Measuring Instrument 33%
• Monitoring System 33%
• Novel Technique 33%
• Ohmic Resistance 66%
• Power Components 66%
• Prognostic Tool 33%
• QFN Package 100%
• QFN Solder Joints 66%
• Quantitative Measurement 33%
• Remaining Useful Life 33%
• Resistance to Change 33%
• Solder Joint 100%
• Speed-power 33%
• Structural Health Monitoring 100%
• Thermal Cycling 33%
• Thermal Performance 33%

Engineering

• Automotives 16%
• Crack Propagation 33%
• Electrical Performance 16%
• Joints (Structural Components) 100%
• Mathematical Model 16%
• Measured Data 16%
• Model Data 16%
• Ohmic Resistance 33%
• Quantitative Measurement 16%
• Resistance Change 16%
• Structural Health Monitoring 100%
• Thermal Cycle 16%
• Thermal Performance 16%