The influence of post angioplasty stent implant profile on arterial wall stress

Mircea Teodorescu, Moshe Brand, Jacob Rosen, Homer Rahnejat

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

One of the main causes for post angioplasty arterial restenosis is the excessive stress induced in the arterial wall during and after the medical intervention. The closed stent is introduced in the artery wrapped around the deflated balloon catheter and is expanded in the final position by inflating the balloon. Unfortunately, this process also stretches the arterial wall. Additionally, for the stent to be successful, its diameter must be slightly larger than the diameter of the inflated artery. The stent is usually a dense mesh of interconnected beams. Therefore, it is often considered that it applies a constant pressure to the artery / stent interface. However, in reality each beam individually presses against the innermost layer of the artery (intima). The current study proposes a model, which predicts the arterial wall subsurface stress field due to individual stent beams. It was found that the local shape of the contact (beam cross section) plays an important role close to the stent / intima contact. Sharper edged cross sections (e.g. square) promote higher stresses. It was observed that during restenosis a new inner layer (neointima) is formed, significantly reducing the stent efficiency. This could be related to local stress concentrations due to the choice of stent beam profile.

Original languageEnglish
Title of host publicationASME 2010 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2010
Pages413-420
Number of pages8
DOIs
StatePublished - 2010
EventASME 2010 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2010 - Montreal, QC, Canada
Duration: 15 Aug 201018 Aug 2010

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume4

Conference

ConferenceASME 2010 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2010
Country/TerritoryCanada
CityMontreal, QC
Period15/08/1018/08/10

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