The Correct Hot Carrier Degradation Model

J. B. Bernstein, E. Bender, A. Bensoussan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

A model for the apparent negative activation energy that is observed when measuring hot carrier degradation has alluded the reliability physics community for several decades. The phenomenon is observed from changes in threshold voltage and mobility degradation and has been distinct from negative bias temperature instability (NBTI) in that the effect consistently increases with lower temperature. This effect is so consistent that an actual negative activation energy can be measured and has been reported from -0.1 to -0.4eV. We propose a model that considers the energetics of HCI that allows the mechanism to be modeled consistently for Silicon and GaN.

Original languageEnglish
Title of host publication2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665456722
DOIs
StatePublished - 2023
Event61st IEEE International Reliability Physics Symposium, IRPS 2023 - Monterey, United States
Duration: 26 Mar 202330 Mar 2023

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2023-March
ISSN (Print)1541-7026

Conference

Conference61st IEEE International Reliability Physics Symposium, IRPS 2023
Country/TerritoryUnited States
CityMonterey
Period26/03/2330/03/23

Keywords

  • FinFET
  • GaN
  • HCI
  • PoF
  • Reliability Engineering

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