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Structural health monitoring of solder joints in QFN package
I. Gershman,
J. B. Bernstein
Research output
:
Contribution to journal
›
Article
›
peer-review
17
Scopus citations
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Dive into the research topics of 'Structural health monitoring of solder joints in QFN package'. Together they form a unique fingerprint.
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Keyphrases
Aerospace
33%
Crack Propagation
66%
Electrical Performance
33%
High Power
33%
Mathematical Model
33%
Measuring Instrument
33%
Monitoring System
33%
Novel Technique
33%
Ohmic Resistance
66%
Power Components
66%
Prognostic Tool
33%
QFN Package
100%
QFN Solder Joints
66%
Quantitative Measurement
33%
Remaining Useful Life
33%
Resistance to Change
33%
Solder Joint
100%
Speed-power
33%
Structural Health Monitoring
100%
Thermal Cycling
33%
Thermal Performance
33%
Engineering
Automotives
16%
Crack Propagation
33%
Electrical Performance
16%
Joints (Structural Components)
100%
Mathematical Model
16%
Measured Data
16%
Model Data
16%
Ohmic Resistance
33%
Quantitative Measurement
16%
Resistance Change
16%
Structural Health Monitoring
100%
Thermal Cycle
16%
Thermal Performance
16%