TY - GEN
T1 - Stepped Impedance Resonator Topology for HTSC RF Front-End
AU - Kurtser, Ilan
AU - Koral, Yoav
AU - Holdengreber, Eldad
AU - Schacham, Shmuel E.
AU - Farber, Eliyahu
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - In this research we demonstrate the simplicity of upgrading radars by adding high temperature superconductor (HTSC) components to the receiver cascade. Based on thin films of Yttrium Barium Copper Oxide (YBCO) HTSC on a Sapphire substrate, we designed an 11 poles band-pass filter with a very low insertion in-band loss, averaging around -0.1 dB, for the S band frequencies. Simulations of a front-end combining two superconducting filters with a cryogenic low noise amplifier, show an ultra-low noise receiver, of 0.057 dB, for a center frequency of 3.3 GHz at 77 K. Advanced 3D electro-magnetic analysis shows that the use of Stepped Impedance Resonator topology for the superconducting filter yields better insertion loss and rejection band than previously used topologies such as Hairpin, with a wider bandwidth, of around 0.1 GHz, and a lower insertion loss, of -0.1 dB, throughout most of the in-band.
AB - In this research we demonstrate the simplicity of upgrading radars by adding high temperature superconductor (HTSC) components to the receiver cascade. Based on thin films of Yttrium Barium Copper Oxide (YBCO) HTSC on a Sapphire substrate, we designed an 11 poles band-pass filter with a very low insertion in-band loss, averaging around -0.1 dB, for the S band frequencies. Simulations of a front-end combining two superconducting filters with a cryogenic low noise amplifier, show an ultra-low noise receiver, of 0.057 dB, for a center frequency of 3.3 GHz at 77 K. Advanced 3D electro-magnetic analysis shows that the use of Stepped Impedance Resonator topology for the superconducting filter yields better insertion loss and rejection band than previously used topologies such as Hairpin, with a wider bandwidth, of around 0.1 GHz, and a lower insertion loss, of -0.1 dB, throughout most of the in-band.
UR - http://www.scopus.com/inward/record.url?scp=85205811459&partnerID=8YFLogxK
U2 - 10.1109/COMCAS58210.2024.10666188
DO - 10.1109/COMCAS58210.2024.10666188
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AN - SCOPUS:85205811459
T3 - 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024
BT - 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024
Y2 - 9 July 2024 through 11 July 2024
ER -