TY - GEN
T1 - Statistical degradation in BGAs for early fault detection
AU - Bender, Emmanuel
AU - Avraham, Tsuriel
AU - Bernstein, Joseph B.
AU - Boning, Duane S.
N1 - Publisher Copyright:
© 2024 ASM International®
PY - 2024
Y1 - 2024
N2 - Here, a method for statistical analysis of BGA pin degradation in packaged devices is presented. A novel testing system is demonstrated featuring parallel monitoring of numerous pins, fast thermal cycling, and precise degradation data generation even in moderate stresses. The resistance change data due to temperature cycling stress is compared to stress on the pin due to location on the chip. The results are vital for localizing vulnerabilities in pins not location specific in the chip. The methods introduced in this study can be expanded to analyze advanced packaging assemblies.
AB - Here, a method for statistical analysis of BGA pin degradation in packaged devices is presented. A novel testing system is demonstrated featuring parallel monitoring of numerous pins, fast thermal cycling, and precise degradation data generation even in moderate stresses. The resistance change data due to temperature cycling stress is compared to stress on the pin due to location on the chip. The results are vital for localizing vulnerabilities in pins not location specific in the chip. The methods introduced in this study can be expanded to analyze advanced packaging assemblies.
UR - http://www.scopus.com/inward/record.url?scp=85212482128&partnerID=8YFLogxK
U2 - 10.31399/asm.cp.istfa2024p0440
DO - 10.31399/asm.cp.istfa2024p0440
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AN - SCOPUS:85212482128
T3 - Conference Proceedings from the International Symposium for Testing and Failure Analysis
SP - 440
EP - 446
BT - ISTFA 2024
PB - ASM International
T2 - 50th International Symposium for Testing and Failure Analysis Conference, ISTFA 2024
Y2 - 28 October 2024 through 1 November 2024
ER -