Abstract
This paper presents a novel technique in the area of solder-joint reliability testing, suggesting a new approach for efficient testing of new products. An analytical model was developed relating the solder-joint ohmic resistance and the joint crack's length caused by temperature cycles. Based on the analytical model, a technique was developed allowing the measurement of a solder-joint's crack length in a nondestructive, continuous way. Thus, prediction of the solder-joint's end-of-life could be done at an early stage of the test, which substantially reduces the test time. This technique of resistance monitoring was validated with a commonly used test vehicle utilizing commercially off-the-shelf daisy-chain quad flat no-lead (QFN44) package. This method is not limited to lab tests, but rather is applicable also for prognostics and preventive maintenance in deployed products.
| Original language | English |
|---|---|
| Article number | 6177654 |
| Pages (from-to) | 748-755 |
| Number of pages | 8 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 2 |
| Issue number | 5 |
| DOIs | |
| State | Published - 2012 |
| Externally published | Yes |
Keywords
- Crack
- end-of-life
- fatigue
- quad flat no-lead (QFN)
- solder-joint
- thermal cycles