TY - GEN
T1 - Reliable laser programmable gate array technology
AU - Gao, Zhuo
AU - Luo, Ji
AU - Huang, Hu
AU - Zhang, Wei
AU - Bernstein, J. B.
N1 - Publisher Copyright:
© 2002 IEEE.
PY - 2002
Y1 - 2002
N2 - Field-programmable gate arrays have become popular ever since their introduction. Compared to other digital circuit implementation media, they have lower non-recurring engineering (NRE) cost and rapid turnaround with the penalties of reduced speed and larger size. Thus better FPGA programmable switch technology is desired in order to gain speed and density advantages. In this paper, laser-induced MakeLink™ technology is proposed as a programmable switch element. The electrical resistance is as low as 0.8 Ω to 11 Ω, depending on the size of the link, which is 2-3 orders smaller than that of NMOS transistor in a SRAM based FPGA. Thus the speed improvement for laser field-programmable gate array (LFPGA) is significant. Other features of laser-induced vertical links technology, such as small size and radiation hardness, can also greatly improve the FPGA performance. The cluster-based LFPGA with 128 by 64 basic logic elements (BLE) is laid out under a 0.5 μm commercialized technology. The chip size is about 138 mm2.
AB - Field-programmable gate arrays have become popular ever since their introduction. Compared to other digital circuit implementation media, they have lower non-recurring engineering (NRE) cost and rapid turnaround with the penalties of reduced speed and larger size. Thus better FPGA programmable switch technology is desired in order to gain speed and density advantages. In this paper, laser-induced MakeLink™ technology is proposed as a programmable switch element. The electrical resistance is as low as 0.8 Ω to 11 Ω, depending on the size of the link, which is 2-3 orders smaller than that of NMOS transistor in a SRAM based FPGA. Thus the speed improvement for laser field-programmable gate array (LFPGA) is significant. Other features of laser-induced vertical links technology, such as small size and radiation hardness, can also greatly improve the FPGA performance. The cluster-based LFPGA with 128 by 64 basic logic elements (BLE) is laid out under a 0.5 μm commercialized technology. The chip size is about 138 mm2.
KW - Costs
KW - Digital circuits
KW - Electric resistance
KW - Field programmable gate arrays
KW - Logic
KW - MOSFETs
KW - Optical arrays
KW - Random access memory
KW - Reliability engineering
KW - Switches
UR - http://www.scopus.com/inward/record.url?scp=84948465512&partnerID=8YFLogxK
U2 - 10.1109/ISQED.2002.996744
DO - 10.1109/ISQED.2002.996744
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AN - SCOPUS:84948465512
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 252
EP - 256
BT - Proceedings of the 2002 3rd International Symposium on Quality Electronic Design, ISQED 2002
PB - IEEE Computer Society
T2 - 3rd International Symposium on Quality Electronic Design, ISQED 2002
Y2 - 18 March 2002 through 21 March 2002
ER -