Keyphrases
Reliability Study
100%
High Density
100%
Ball Grid Array Package
100%
Die Crack
100%
Metallized
100%
Thin Film Delamination
100%
Failure Rate
66%
Process Improvement
66%
Delamination Defect
66%
Cu Metallization
66%
Fillet
66%
Statistical Analysis
33%
Failure Mechanism
33%
Low Stress
33%
Resin
33%
Reliability Testing
33%
Body Size
33%
Overall Reliability
33%
Defect-induced
33%
Initial Crack
33%
Solder Joint Reliability
33%
Reliability Issues
33%
Die-attach
33%
Manufacturing Difficulty
33%
Early Life Failure
33%
Screening Scheme
33%
Improvement Plan
33%
Wafer Sawing Process
33%
Board Level Reliability
33%
Life Needs
33%
Die-attach Materials
33%
Wafer Sawing
33%
Sample Screening
33%
Die Size
33%
Edge Defects
33%
Engineering
Thin Films
100%
Reliability Study
100%
Ball Grid Arrays
100%
Delamination
100%
Failure Rate
66%
Process Improvement
66%
Metallizations
66%
Joints (Structural Components)
33%
Failure Mechanism
33%
Test Result
33%
Initial Crack
33%
Induced Defect
33%
Body Size
33%
Life Application
33%
Improvement Plan
33%
Early Life
33%
Life Failure
33%