Reliability simulation and design consideration of high speed ADC circuits

Baoguang Yan, Jin Qin, Jun Dai, Qingguo Fan, Joseph B. Bernstein

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

For the first time, a high speed flash ADC is developed for reliability analysis and simulation of analogue and mix-signal circuit. All the three failure mechanisms (NBTI, HCI, TDDB) are quantified with degradation models. The result shows that pMOS degradation especially NBTI is the most detrimental failure mechanism for the normal operation of high speed ADC, which leads to the fault output. Based on the analysis of the reliability-critical parts, reliability improvement approaches are suggested for the reliable design.

Original languageEnglish
Title of host publication2008 IEEE International Integrated Reliability Workshop Final Report, IRW 2008
Pages125-128
Number of pages4
DOIs
StatePublished - 2008
Externally publishedYes
Event2008 IEEE International Integrated Reliability Workshop, IRW 2008 - South Lake Tahoe, CA, United States
Duration: 12 Oct 200816 Oct 2008

Publication series

NameIEEE International Integrated Reliability Workshop Final Report

Conference

Conference2008 IEEE International Integrated Reliability Workshop, IRW 2008
Country/TerritoryUnited States
CitySouth Lake Tahoe, CA
Period12/10/0816/10/08

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