Modern Trends in Microelectronics Packaging Reliability Testing

Emmanuel Bender; Joseph B. Bernstein; Duane S. Boning

doi:10.3390/mi15030398

Modern Trends in Microelectronics Packaging Reliability Testing

Emmanuel Bender, Joseph B. Bernstein, Duane S. Boning

Department of Electrical and Electronics Engineering

Research output: Contribution to journal › Review article › peer-review

Abstract

In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes.

Original language	English
Article number	398
Journal	Micromachines
Volume	15
Issue number	3
DOIs	https://doi.org/10.3390/mi15030398
State	Published - Mar 2024

Keywords

fan-out packaging
packaging reliability
reliability prediction
silicon interconnect fabric
solder ball failure

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10.3390/mi15030398

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title = "Modern Trends in Microelectronics Packaging Reliability Testing",

abstract = "In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes.",

keywords = "fan-out packaging, packaging reliability, reliability prediction, silicon interconnect fabric, solder ball failure",

author = "Emmanuel Bender and Bernstein, {Joseph B.} and Boning, {Duane S.}",

note = "Publisher Copyright: {\textcopyright} 2024 by the authors.",

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doi = "10.3390/mi15030398",

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Modern Trends in Microelectronics Packaging Reliability Testing

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Keywords

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