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Metal wire cutting by repeated application of low-power laser pulses
Joseph B. Bernstein
, Simon S. Cohen
, Peter W. Wyatt
Research output
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Contribution to journal
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Article
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peer-review
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Keyphrases
Repeated Application
100%
Laser Pulse
100%
Low-level Laser
100%
Metal Wire
100%
Wire-cut
100%
Single Pulse
33%
Redundancy
33%
Microelectronics
33%
Metal Line
33%
Metallic Films
33%
Aluminum Alloy Wire
33%
Power Required
33%
Ion Source
33%
Thermal Fatigue
33%
Argon Ions
33%
Engineering
Repeated Application
100%
Power Laser
100%
Metal Wire
100%
Microelectronics
50%
Single Pulse
50%
Induced Fatigue
50%
Cut Metal
50%
Ion Source
50%
Material Science
Laser Pulse
100%
Metallic Films
33%
Aluminum Alloy
33%
Physics
Laser Pulse
100%
Ion Source
33%
Alloy
33%