Abstract
Thermomechanical fatigue, induced by the repeated application of a sufficiently powerful laser pulse, will eventually cause a metallic film to fail. This principle is proposed to cut metal lines for deletive redundancy in microelectronics. Aluminum alloy wires were cut with a series of 5 μs pulses from an argon ion source. The power required to cut 4-μm-wide, 0.75-μm-thick lines was reduced by as much as 87% from that of a single 5 μs laser pulse. By comparison to a single pulse of equal total time, a 70% reduction in power has been realized.
| Original language | English |
|---|---|
| Pages (from-to) | 3516-3518 |
| Number of pages | 3 |
| Journal | Review of Scientific Instruments |
| Volume | 63 |
| Issue number | 6 |
| DOIs | |
| State | Published - 1992 |
| Externally published | Yes |