Laser-induced microfracture leading to high-density metal-to-metal connections

Keyphrases

• Laser-induced 100%
• High Density 100%
• Link Formation 100%
• Metal(II) 100%
• Microfracture 100%
• Customization 50%
• Redundancy 50%
• Two-level 50%
• High Reliability 50%
• Finite Element Analysis 50%
• Dielectric Layer 50%
• Molten Metal 50%
• Metallization 50%
• Microstructural Analysis 50%
• Integrated Circuits 50%
• Annular Region 50%
• Physical Connectivity 50%
• Thermal Expansion 50%
• Field Programmable Gate Arrays 50%
• Metal Interconnect 50%
• Interconnect Line 50%
• Device Geometry 50%
• Interlevel Dielectrics 50%
• Focussed Ion Beam 50%
• Micrography 50%

Engineering

• Dielectric Layer 100%
• Interconnects 100%
• Metallizations 100%
• Annular Region 100%
• Customisation 100%
• Microfracture 100%
• Cross Beam 100%
• Finite Element Analysis 100%
• Liquid Metal 100%
• Integrated Circuit 100%

Material Science

• Density 100%
• Electronic Circuit 50%
• Finite Element Method 50%
• Liquid Metal 50%
• Thermal Expansion 50%
• Microstructural Analysis 50%
• Micrography 50%
• Dielectric Material 50%