Laser-Formed Metallic Connections Employing a Lateral Link Structure

Joseph B. Bernstein; Barry D. Colella

doi:10.1109/95.465171

Laser-Formed Metallic Connections Employing a Lateral Link Structure

Joseph B. Bernstein, Barry D. Colella

Research output: Contribution to journal › Article › peer-review

18 Scopus citations

Abstract

Laser-programmed connections between metal lines on the same level of metallization have been developed as a means to achieve high density linking for customization in programmable gate arrays and for additive redundancy in restructurable integrated circuits. This work reports on the linking of aluminum based metal interconnect using a Q-switched diode pumped solid state laser where perfect yield was achieved. The links were formed by focusing the laser between two adjacent lines of metal, one of which was connected to a lower level of metal through a contact via. The resistance of the connections was approximately 3.0 Ω, including two vias and a connecting length of lower level metal.

Original language	English
Pages (from-to)	690-692
Number of pages	3
Journal	IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume	18
Issue number	3
DOIs	https://doi.org/10.1109/95.465171
State	Published - Sep 1995
Externally published	Yes

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title = "Laser-Formed Metallic Connections Employing a Lateral Link Structure",

abstract = "Laser-programmed connections between metal lines on the same level of metallization have been developed as a means to achieve high density linking for customization in programmable gate arrays and for additive redundancy in restructurable integrated circuits. This work reports on the linking of aluminum based metal interconnect using a Q-switched diode pumped solid state laser where perfect yield was achieved. The links were formed by focusing the laser between two adjacent lines of metal, one of which was connected to a lower level of metal through a contact via. The resistance of the connections was approximately 3.0 Ω, including two vias and a connecting length of lower level metal.",

author = "Bernstein, {Joseph B.} and Colella, {Barry D.}",

note = "Funding Information: Manuscript received March 6, 1995; revised April 13, 1995. This work was supported by the Department of Defense. J. B. Bemstein was with the Massachusetts Institute of Technology, Lincoln Laboratory, Lexington, MA 02173-9108 USA. He is now with the Department of Materials and Nuclear Engineering, University of Maryland, College Park, MD 20742 USA. B. D. Colella is with the Massachusetts Institute of Technology, Lincoln Laboratory, Lexington MA 02173. IEEE Log Number 9413116.",

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Laser-Formed Metallic Connections Employing a Lateral Link Structure

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