Abstract
Solid metallic connections have been successfully formed between two standard levels of metallization using a focussed IR laser system. This new process of laser farmed connections has been used to link chins with resistances of less than 0.8 Ω per connection. Commercial laser repair systems used extensively by the memory industry were employed to perform over 100,000 individual links over a wide set of laser parameters without failure. This technology has the potential to replace laser fuse cutting techniques to program wiring in silicon-on-silicon, wafer scale integration (WSI), and system-on-a-chip applications. Furthermore, because it is an additive process and the passivation remains completely in tact, it lends itself to redundancy with perfect yield and exceptional reliability.
| Original language | English |
|---|---|
| Pages (from-to) | 163-165 |
| Number of pages | 3 |
| Journal | Proceedings of the Custom Integrated Circuits Conference |
| State | Published - 1998 |
| Externally published | Yes |
| Event | Proceedings of the 1998 IEEE Custom Integrated Circuits Conference - Santa Clara, CA, USA Duration: 11 May 1998 → 14 May 1998 |