Impact of the trapping of anode hot holes on silicon dioxide breakdown

Eric M. Vogel, Da Wei Heh, Joseph B. Bernstein, John S. Suehle

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

Hot holes are injected from the anode and trapped in thin silicon dioxide using constant voltage stress at large gate voltage. By comparing oxides having trapped holes with oxides in which the holes were detrapped, it is shown that the presence of trapped holes does not affect the breakdown of the oxide. Furthermore, as the temperature during stress is increased, less hole trapping is observed whereas the charge-to-breakdown of the oxide is decreased. The results show that although the trapping of hot holes injected using anode hole injection (AHI) may be partly responsible for defect generation in silicon dioxide, breakdown cannot be limited by the number of holes trapped in the oxide.

Original languageEnglish
Pages (from-to)667-669
Number of pages3
JournalIEEE Electron Device Letters
Volume23
Issue number11
DOIs
StatePublished - Nov 2002
Externally publishedYes

Keywords

  • CMOS
  • Defect generation
  • Reliability
  • Silicon dioxide
  • Time-dependent dielectric breakdown

Fingerprint

Dive into the research topics of 'Impact of the trapping of anode hot holes on silicon dioxide breakdown'. Together they form a unique fingerprint.

Cite this