Abstract
Impact of substrate hot hole injection on ultrathin silicon dioxide breakdown was discussed. It was found that different breakdown mechanisms may dominate or different defects were generated under different stress conditions. The results showed that defects generated by hot holes had little or no influence on breakdown during constant voltage stress (CVS).
Original language | English |
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Pages (from-to) | 3242-3244 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 82 |
Issue number | 19 |
DOIs | |
State | Published - 12 May 2003 |
Externally published | Yes |