Impact of substrate hot hole injection on ultrathin silicon dioxide breakdown

Dawei Heh, Eric M. Vogel, Joseph B. Bernstein

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

Impact of substrate hot hole injection on ultrathin silicon dioxide breakdown was discussed. It was found that different breakdown mechanisms may dominate or different defects were generated under different stress conditions. The results showed that defects generated by hot holes had little or no influence on breakdown during constant voltage stress (CVS).

Original languageEnglish
Pages (from-to)3242-3244
Number of pages3
JournalApplied Physics Letters
Volume82
Issue number19
DOIs
StatePublished - 12 May 2003
Externally publishedYes

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