TY - GEN
T1 - FaRBS
T2 - Annual Reliability and Maintainability Symposium, RAMS 2011
AU - Qin, Jin
AU - Avshalom, Hava
AU - Bernstein, Joseph B.
PY - 2011
Y1 - 2011
N2 - FaRBS (Failure Rate Based Simulation Program with Integrated Circuit Emphasis) is a new physics-of-failure based Very Large Scale Integration (VLSI) circuit reliability prediction method. With multiple failure mechanisms inh erently modeled and analyzed, FaRBS will make reliability engineers' life much easier by directly revealing each stress's acceleration effect at system level, thus helping reliability engineers carry out system level VLSI reliability predictions and derating/uprating analyses. Based on Physics-of-Failure (PoF) models of intrinsic failure mechanisms, FaRBS takes a straightforward top-down, bottom-up approach to reduce both modeling and prediction complexity. Detailed application breakdown from the system level reveals bottom-level device's operation profile. Devicelevel reliability characterization provides accurate operation-ba sed dynamic stress modeling by utilizing the physics-of-failure models. For each failure mechanism, the best-fit lifetime distribution is selected to provide the reliability prediction. With the bottom level device reliability prediction, the application-specific circuit and corresponding system reliability is further predicted by considering the system structure. To demonstrate FaRBS and verify its prediction capability, reliability predictions were performed on a microcontroller, DRAM and microprocessor. The predicted failure rates were compared with field data (from 2002 to 20 09) and demonstrate that the prediction agrees very well with the real failure rates.
AB - FaRBS (Failure Rate Based Simulation Program with Integrated Circuit Emphasis) is a new physics-of-failure based Very Large Scale Integration (VLSI) circuit reliability prediction method. With multiple failure mechanisms inh erently modeled and analyzed, FaRBS will make reliability engineers' life much easier by directly revealing each stress's acceleration effect at system level, thus helping reliability engineers carry out system level VLSI reliability predictions and derating/uprating analyses. Based on Physics-of-Failure (PoF) models of intrinsic failure mechanisms, FaRBS takes a straightforward top-down, bottom-up approach to reduce both modeling and prediction complexity. Detailed application breakdown from the system level reveals bottom-level device's operation profile. Devicelevel reliability characterization provides accurate operation-ba sed dynamic stress modeling by utilizing the physics-of-failure models. For each failure mechanism, the best-fit lifetime distribution is selected to provide the reliability prediction. With the bottom level device reliability prediction, the application-specific circuit and corresponding system reliability is further predicted by considering the system structure. To demonstrate FaRBS and verify its prediction capability, reliability predictions were performed on a microcontroller, DRAM and microprocessor. The predicted failure rates were compared with field data (from 2002 to 20 09) and demonstrate that the prediction agrees very well with the real failure rates.
KW - DRAM
KW - VLSI
KW - microprocessor
KW - physics of failure
KW - reliability prediction
UR - http://www.scopus.com/inward/record.url?scp=79956340932&partnerID=8YFLogxK
U2 - 10.1109/RAMS.2011.5754493
DO - 10.1109/RAMS.2011.5754493
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AN - SCOPUS:79956340932
SN - 9781424451036
T3 - Proceedings - Annual Reliability and Maintainability Symposium
BT - 2011 Proceedings - Annual Reliability and Maintainability Symposium, RAMS 2011
Y2 - 24 January 2011 through 27 January 2011
ER -