Failure rate estimation of known failure mechanisms of electronic packages

Keyphrases

• Failure Mechanism 100%
• Failure Rate 100%
• Electronic Packaging 100%
• Failure Rate Prediction 100%
• Confidence Bounds 100%
• Statistical Features 50%
• Failure number 50%
• Electronic Components 50%
• Stress Testing 50%
• Chi-square Statistic 50%
• Acceleration Factor 50%
• Failure Phenomena 50%
• Failure Data 50%
• Constant Failure Rate 50%
• Rate-based 50%
• Solder Joint 50%
• Expected number of Failures 50%
• Accelerated Testing 50%
• Product Reliability 50%
• Product Launch 50%
• Failure Rate Modeling 50%

Engineering

• Failure Rate 100%
• Failure Mechanism 100%
• Application Field 50%
• Joints (Structural Components) 25%
• Acceleration Factor 25%
• Failure Data 25%
• Constant Failure Rate 25%
• Product Reliability 25%
• Product Launch 25%
• Statistical Characteristic 25%
• Case Study 25%

Computer Science

• Confidence Bound 100%
• Observed Failure 100%
• Case Study 50%
• Successful Product 50%
• Constant Failure Rate 50%