TY - GEN
T1 - Enhanced gate induced drain leakage current in HfO2 MOSFETs due to remote interface trap-assisted tunneling
AU - Gurfinkel, M.
AU - Suehle, J. S.
AU - Bernstein, J. B.
AU - Shapira, Yoram
PY - 2006
Y1 - 2006
N2 - High-κ dielectric gate stack MOSFETs have been characterized by separating the transversal and lateral electric field contributions to the substrate current. The results show that at low gate biases the substrate current is dominated by a trap-assisted tunneling component denoted by gate induced drain leakage (GIDL) current, which is not observed in conventional SiO2 devices. Ultra-fast substrate current measurements rule out transient charging of the gate oxide as the cause of this component. A physical model of the observed substrate current dependence is proposed.
AB - High-κ dielectric gate stack MOSFETs have been characterized by separating the transversal and lateral electric field contributions to the substrate current. The results show that at low gate biases the substrate current is dominated by a trap-assisted tunneling component denoted by gate induced drain leakage (GIDL) current, which is not observed in conventional SiO2 devices. Ultra-fast substrate current measurements rule out transient charging of the gate oxide as the cause of this component. A physical model of the observed substrate current dependence is proposed.
UR - http://www.scopus.com/inward/record.url?scp=46049089452&partnerID=8YFLogxK
U2 - 10.1109/IEDM.2006.346896
DO - 10.1109/IEDM.2006.346896
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AN - SCOPUS:46049089452
SN - 1424404398
SN - 9781424404391
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2006 International Electron Devices Meeting Technical Digest, IEDM
T2 - 2006 International Electron Devices Meeting, IEDM
Y2 - 10 December 2006 through 13 December 2006
ER -