Electromigration simulation under DC/AC stresses considering microstructure

Wei Zhang; Joseph B. Bernstein

doi:10.1109/IITC.1999.787072

Electromigration simulation under DC/AC stresses considering microstructure

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this work, we present a dynamic finite difference simulation on the stress evolution along the interconnect under both DC and AC current densities, while taking into account the inhomogeneity of grain size and grain boundary orientation. Furthermore, we related both the accelerating stress and microstructural conditions to the lifetime by assuming certain built-up stress levels as failure criteria.

Original language	English
Title of host publication	Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	41-43
Number of pages	3
ISBN (Electronic)	0780351746, 9780780351745
DOIs	https://doi.org/10.1109/IITC.1999.787072
State	Published - 1999
Externally published	Yes
Event	1999 IEEE International Interconnect Technology Conference, IITC 1999 - San Francisco, United States Duration: 24 May 1999 → 26 May 1999

Publication series

Name	Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Conference

Conference	1999 IEEE International Interconnect Technology Conference, IITC 1999
Country/Territory	United States
City	San Francisco
Period	24/05/99 → 26/05/99

Access to Document

10.1109/IITC.1999.787072

Cite this

Zhang, W., & Bernstein, J. B. (1999). Electromigration simulation under DC/AC stresses considering microstructure. In Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999 (pp. 41-43). Article 787072 (Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC.1999.787072

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title = "Electromigration simulation under DC/AC stresses considering microstructure",

abstract = "In this work, we present a dynamic finite difference simulation on the stress evolution along the interconnect under both DC and AC current densities, while taking into account the inhomogeneity of grain size and grain boundary orientation. Furthermore, we related both the accelerating stress and microstructural conditions to the lifetime by assuming certain built-up stress levels as failure criteria.",

author = "Wei Zhang and Bernstein, {Joseph B.}",

note = "Publisher Copyright: {\textcopyright} 1999 IEEE.; 1999 IEEE International Interconnect Technology Conference, IITC 1999 ; Conference date: 24-05-1999 Through 26-05-1999",

year = "1999",

doi = "10.1109/IITC.1999.787072",

language = "אנגלית",

series = "Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999",

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booktitle = "Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999",

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Zhang, W & Bernstein, JB 1999, Electromigration simulation under DC/AC stresses considering microstructure. in Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999., 787072, Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999, Institute of Electrical and Electronics Engineers Inc., pp. 41-43, 1999 IEEE International Interconnect Technology Conference, IITC 1999, San Francisco, United States, 24/05/99. https://doi.org/10.1109/IITC.1999.787072

Electromigration simulation under DC/AC stresses considering microstructure. / Zhang, Wei; Bernstein, Joseph B.
Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999. Institute of Electrical and Electronics Engineers Inc., 1999. p. 41-43 787072 (Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Zhang W, Bernstein JB. Electromigration simulation under DC/AC stresses considering microstructure. In Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999. Institute of Electrical and Electronics Engineers Inc. 1999. p. 41-43. 787072. (Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999). doi: 10.1109/IITC.1999.787072

Electromigration simulation under DC/AC stresses considering microstructure

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