Keyphrases
Cleaning Methods
100%
Ball Grid Array Package
100%
Plasma Cleaning
100%
Assembly Reliability
100%
Plastic Ball Grid Array
100%
Interface Delamination
30%
Pull Test
20%
Plasma System
20%
Temperature Conditions
10%
Loading Conditions
10%
Scanning Electron Microscopy
10%
Failure Mechanism
10%
Vapor Pressure
10%
Encapsulation Techniques
10%
Process Yield
10%
Shear Test
10%
Moisture
10%
Pull Strength
10%
Surface Contact Angle
10%
Contact Angle Measurement
10%
Wire Bonding Process
10%
Microelectronics Packaging
10%
Major Failure
10%
Process Productivity
10%
Processed Material
10%
Strength Degradation
10%
Adhesion Strength
10%
Peel Test
10%
Bonding Wire
10%
Reflow Process
10%
C-mode
10%
Radiofrequency Energy
10%
Moisture Condition
10%
Qualification Level
10%
Cyclic Load
10%
PBGA Package
10%
Interface Adhesion Strength
10%
Soldering
10%
Package Qualification
10%
Interface Material
10%
Hydrothermal Stress
10%
Wire Pull Test
10%
Die-attach
10%
Microwave Energy
10%
Engineering
Ball Grid Arrays
100%
Delamination
100%
Pull Test
66%
Plasma System
66%
Experimental Result
33%
Radio Frequency
33%
Microelectronics
33%
Failure Mechanism
33%
Process Parameter
33%
Contact Angle Measurement
33%
Material Interface
33%
Bonding Wire
33%
Bonding Process
33%
Peel Test
33%
Pull Strength
33%
Process Yield
33%
Major Failure
33%
Cyclic Loads
33%
Strength Degradation
33%
Test Vehicle
33%