Skip to main navigation
Skip to search
Skip to main content
Ariel University Home
Help & FAQ
Link opens in a new tab
English
עברית
العربية
Search content at Ariel University
Home
Profiles
Research units
Equipment
Research output
Prizes
Activities
Press/Media
Dielectric fracture leading to metallic connections by laser heating
J. B. Bernstein
Research output
:
Contribution to journal
›
Conference article
›
peer-review
1
Scopus citations
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Dielectric fracture leading to metallic connections by laser heating'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
Dielectric
100%
Passivation
100%
Metallization
100%
Adjacent Lines
100%
Laser Heating
100%
Customization
50%
Redundancy
50%
High Density
50%
Pulsed Laser
50%
Tact
50%
Fissure
50%
Integrated Circuits
50%
Link Formation
50%
Molten Aluminum
50%
Thermal Expansion
50%
Field Programmable Gate Arrays
50%
Engineering
Dielectrics
100%
Passivation
100%
Metallizations
100%
Laser Heating
100%
Customisation
50%
Pulsed Laser
50%
Integrated Circuit
50%
Material Science
Density
100%
Electronic Circuit
100%
Aluminum
100%
Thermal Expansion
100%
Dielectric Material
100%
Chemical Engineering
Metallizing
100%