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Comparison of silicon carbide and GaAs schottky diode
J. Luo
, K. Chung
, H. Huang
,
J. B. Bernstein
Department of Electrical and Electronics Engineering
Research output
:
Contribution to conference
›
Paper
›
peer-review
1
Scopus citations
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Keyphrases
Accelerated Life Test
25%
Activation Energy
25%
Baliga's Figure of Merit
25%
Commercially Available
25%
Current Density
25%
Device Application
50%
Device Characterization
25%
Electric Breakdown Field
25%
Electrical Performance
25%
Electrical Reliability
25%
Electron Drift Velocity
25%
GaAs Devices
25%
GaAs Schottky Diode
100%
Gallium Arsenide
100%
High Forward Current
25%
High Temperature
25%
High Temperature Operation
25%
High-temperature Device
25%
Mean Time to Failure
25%
On-state
25%
Phonon Scattering
25%
Power Device
75%
Reverse Breakdown Voltage
25%
Scattering Theory
25%
Silicon Carbide
100%
Silicon Carbide Schottky Barrier Diode
100%
Temperature Effect
25%
Test Temperature
25%
Thermal Conductivity
25%
Engineering
Accelerated Life Test
20%
Activation Energy
20%
Breakdown Field
20%
Breakdown Voltage
20%
Drift Velocity
20%
Electrical Performance
20%
Figure of Merit
20%
Gaas Device
20%
Gallium Arsenide
100%
High Operating Temperature
20%
Mean Time to Failure
20%
Power Device
60%
Temperature Dependence
20%
Test Temperature
20%
Thermal Conductivity
20%
Material Science
Activation Energy
16%
Density
16%
Gallium Arsenide
100%
Power Device
50%
Schottky Diode
100%
Silicon Carbide
100%
Thermal Conductivity
16%