TY - JOUR
T1 - Bistable Micro Caps Fabricated by Sheet Metal Forming
AU - Asher, A.
AU - Benjamin, E.
AU - Medina, L.
AU - Gilat, R.
AU - Krylov, S.
N1 - Publisher Copyright:
© 2020 IOP Publishing Ltd.
PY - 2020/6
Y1 - 2020/6
N2 - Traditional fabrication techniques are not suitable for the manufacturing of three-dimensional micro-scale structures. In this work, we report on a modified self molding punch-less sheet forming technique allowing fabrication of initially curved, non-planar, shallow micro shells. These structures, when appropriately configured, may exhibit the coexistence of two equilibria under the same loading. A ≈ 400 nm thick layer of Al, or ≈ 2.5 µm of Cu was deposited on top of a Si wafer. Next, circular openings of the radii varying between ≈ 100 µm and up to ≈ 700 µm were created in the Si substrate by means of the deep reactive ion etching (DRIE), with the metallic layer serving as the etch stop. Finally, the circular free-standing metallic sheet was pressed by a soft uniform foam layer serving as a stamp and pushing the metal foil into the opening in the wafer. Induced plastic deformation resulted in a residual strain shaping an initially planar metal sheet into a shallow cap with the midpoint elevations up to ≈ 50 µm. Metallic as well as metal-polymer bimorph caps, of the thickness varying between ≈ 400 nm and up to ≈ 2.5 µm and of the desired curvature, were successfully fabricated by the suggested process. Snap-through and snap-back of the fabricated devices under mechanical and electrostatic actuation was demonstrated experimentally.
AB - Traditional fabrication techniques are not suitable for the manufacturing of three-dimensional micro-scale structures. In this work, we report on a modified self molding punch-less sheet forming technique allowing fabrication of initially curved, non-planar, shallow micro shells. These structures, when appropriately configured, may exhibit the coexistence of two equilibria under the same loading. A ≈ 400 nm thick layer of Al, or ≈ 2.5 µm of Cu was deposited on top of a Si wafer. Next, circular openings of the radii varying between ≈ 100 µm and up to ≈ 700 µm were created in the Si substrate by means of the deep reactive ion etching (DRIE), with the metallic layer serving as the etch stop. Finally, the circular free-standing metallic sheet was pressed by a soft uniform foam layer serving as a stamp and pushing the metal foil into the opening in the wafer. Induced plastic deformation resulted in a residual strain shaping an initially planar metal sheet into a shallow cap with the midpoint elevations up to ≈ 50 µm. Metallic as well as metal-polymer bimorph caps, of the thickness varying between ≈ 400 nm and up to ≈ 2.5 µm and of the desired curvature, were successfully fabricated by the suggested process. Snap-through and snap-back of the fabricated devices under mechanical and electrostatic actuation was demonstrated experimentally.
UR - http://www.scopus.com/inward/record.url?scp=85084521488&partnerID=8YFLogxK
U2 - 10.1088/1361-6439/ab7f52
DO - 10.1088/1361-6439/ab7f52
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AN - SCOPUS:85084521488
SN - 0960-1317
VL - 30
JO - Journal of Micromechanics and Microengineering
JF - Journal of Micromechanics and Microengineering
IS - 6
M1 - 065002
ER -