Fingerprint
Dive into the research topics of 'Assessment of acceleration models used for BGA solder joint reliability studies'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Assessment of acceleration models used for BGA solder joint reliability studies
Liyu Yang, Joseph B. Bernstein, T. Koschmieder
Research output: Contribution to journal › Article › peer-review
15
Scopus
citations