Keyphrases
Reliability Study
100%
Solder Joint
100%
Solder Joint Reliability
100%
Acceleration Model
100%
BGA Solder Joint
100%
Solder Joint Fatigue Life
40%
Package Structure
40%
Temperature Effect
20%
Temperature Range
20%
Shock Conditions
20%
Electronic Packaging
20%
Failure Data
20%
Model Form
20%
Maximum Temperature
20%
Reliability Performance
20%
Electronics Reliability
20%
Thermal Shock
20%
Life Model
20%
Fatigue Life
20%
Development Time
20%
Life Performance
20%
Development Cost
20%
Added Cost
20%
Norris-Landzberg Model
20%
Joint Microstructure
20%
Cycle Frequency
20%
Ramp Rate
20%
Joint Material
20%
Engineering Approach
20%
Reliability Engineering
20%
Package Materials
20%
Use Conditions
20%
Joint Lives
20%
Solder Interconnect
20%
Engineering
Joints (Structural Components)
100%
Reliability Study
100%
Model Parameter
33%
Fatigue Life
33%
Acceleration Factor
22%
Empirical Model
22%
Temperature Range
11%
Failure Data
11%
Maximum Temperature
11%
Life Model
11%
Test Sample
11%
Development Cost
11%
Added Cost
11%
Cycle Frequency
11%
Ramp Rate
11%
Field Life
11%
Reliability Engineering
11%
Material Science
Solder Joint
100%
Fatigue of Materials
33%
Thermal Shock
11%