Acceleration factors and mechanistic study of progressive breakdown in small area ultra-thin gate oxides

J. S. Suehle, B. Zhu, Y. Che, J. B. Bernstein

Research output: Contribution to journalConference articlepeer-review

17 Scopus citations

Abstract

Two post soft breakdown modes are studied: one in which the conducting filament is stable until hard breakdown occurs and one in which the filament continually degrades with time. Acceleration factors are different for each mode, indicating different physical mechanisms. The results suggest that the "hardness" of the first breakdown influences the residual time distribution of the following hard breakdown. Tunneling current appears to be the driving force for both modes.

Original languageEnglish
Pages (from-to)95-101
Number of pages7
JournalIEEE International Reliability Physics Symposium Proceedings
StatePublished - 2004
Externally publishedYes
Event42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004 - Phoenix, United States
Duration: 25 Apr 200429 Apr 2004

Keywords

  • CMOS
  • Dielectric breakdown
  • Oxide reliability
  • Silicon dioxide

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