Abstract
Two post soft breakdown modes are studied: one in which the conducting filament is stable until hard breakdown occurs and one in which the filament continually degrades with time. Acceleration factors are different for each mode, indicating different physical mechanisms. The results suggest that the "hardness" of the first breakdown influences the residual time distribution of the following hard breakdown. Tunneling current appears to be the driving force for both modes.
Original language | English |
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Pages (from-to) | 95-101 |
Number of pages | 7 |
Journal | IEEE International Reliability Physics Symposium Proceedings |
State | Published - 2004 |
Externally published | Yes |
Event | 42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004 - Phoenix, United States Duration: 25 Apr 2004 → 29 Apr 2004 |
Keywords
- CMOS
- Dielectric breakdown
- Oxide reliability
- Silicon dioxide