A unified SPICE compatible model for large and small signal envelope simulation of linear circuits excited by modulated signals

Simon Lineykin, Sam Ben-Yaakov

Research output: Contribution to journalConference articlepeer-review

17 Scopus citations

Abstract

The envelope simulation method, developed earlier for large signal simulation (time domain, TRAN), is extended to include small signal envelope simulation (AC) and DC Sweep simulation (steady state for a range of carrier frequencies). The model is derived for AM, FM and PM modulation schemes and is demonstrated on a piezoelectric transformer circuit. The analytical derivations of the model were verified against full circuit simulations that include the high frequency carrier. Excellent agreement was found between the simulation results according to the new unified envelope model and the full simulation.

Original languageEnglish
Pages (from-to)1205-1209
Number of pages5
JournalPESC Record - IEEE Annual Power Electronics Specialists Conference
Volume3
StatePublished - 2003
Externally publishedYes
Event2003 IEEE 34th Annual Power Electronics Specialists Conference - Acapulco, NM, United States
Duration: 15 Jun 200319 Jun 2003

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