TY - GEN
T1 - Towards a new simulation testbed for semiconductor manufacturing
AU - Hassoun, Michael
AU - Kalir, Adar
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/6/28
Y1 - 2017/6/28
N2 - We propose the creation of a new set of fab simulation testbeds. Extensions and additional features, not considered in the original MIMAC datasets, shall be incorporated in these new testbeds, thus allowing researchers to evaluate new methodologies with the same frame of reference. To do this, we surveyed the literature and mapped the pertinent research efforts of the past two decades. In this paper, we discuss in detail the various aspects of the new testbeds, in order to receive feedback from the simulation community on the importance of inclusion of some of the items in question; and the verification of the required inclusion of other items. Given the feedback, we aim to generate these testbeds within a year to serve as the new frame of reference for the benefit of the entire semiconductor manufacturing simulation community.
AB - We propose the creation of a new set of fab simulation testbeds. Extensions and additional features, not considered in the original MIMAC datasets, shall be incorporated in these new testbeds, thus allowing researchers to evaluate new methodologies with the same frame of reference. To do this, we surveyed the literature and mapped the pertinent research efforts of the past two decades. In this paper, we discuss in detail the various aspects of the new testbeds, in order to receive feedback from the simulation community on the importance of inclusion of some of the items in question; and the verification of the required inclusion of other items. Given the feedback, we aim to generate these testbeds within a year to serve as the new frame of reference for the benefit of the entire semiconductor manufacturing simulation community.
UR - http://www.scopus.com/inward/record.url?scp=85044545726&partnerID=8YFLogxK
U2 - 10.1109/WSC.2017.8248074
DO - 10.1109/WSC.2017.8248074
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AN - SCOPUS:85044545726
T3 - Proceedings - Winter Simulation Conference
SP - 3612
EP - 3623
BT - 2017 Winter Simulation Conference, WSC 2017
A2 - Chan, Victor
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 Winter Simulation Conference, WSC 2017
Y2 - 3 December 2017 through 6 December 2017
ER -