@inproceedings{d954832e05274574be9a1304498dab0c,
title = "The Effects of Process Variations and BTI in Packaged FinFET Devices",
abstract = "A correlation between device reliability and process variations in packaged devices is identified. Weibull distribution statistics are used in a novel method for finding the limit of precision possible for time-to-failure averaging. This study identifies increase of variance due to process variation with size scaling in three generations of technologies. There is a linear decrease in precision threshold which correlates to the size of the device. The results present a concern of BTI in technologies from 16nm and below.",
keywords = "BTI, FPGA, FinFET, Process Variations, RO, SHE",
author = "E. Bender and Bernstein, \{J. B.\} and Boning, \{D. S.\}",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 61st IEEE International Reliability Physics Symposium, IRPS 2023 ; Conference date: 26-03-2023 Through 30-03-2023",
year = "2023",
doi = "10.1109/IRPS48203.2023.10117980",
language = "אנגלית",
series = "IEEE International Reliability Physics Symposium Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings",
address = "ארצות הברית",
}