Statistical degradation in BGAs for early fault detection

Here, a method for statistical analysis of BGA pin degradation in packaged devices is presented. A novel testing system is demonstrated featuring parallel monitoring of numerous pins, fast thermal cycling, and precise degradation data generation even in moderate stresses. The resistance change data due to temperature cycling stress is compared to stress on the pin due to location on the chip. The results are vital for localizing vulnerabilities in pins not location specific in the chip. The methods introduced in this study can be expanded to analyze advanced packaging assemblies.