Investigation of metal-polycrystalline silicon carbide bonding while metallization

G. Golan, V. Manevych, I. Lapsker, B. Gorenstein, A. Axelevitch

نتاج البحث: فصل من :كتاب / تقرير / مؤتمرمنشور من مؤتمرمراجعة النظراء

ملخص

Polycrystalline silicon carbide heaters o rheated substrates are widely used within the semiconductor industry. The problem of making reliable contacts between such SiC and various metals is most relevant. The main goal of our investigation was an experimental study of molten metals (Fe, Cu, Cr) behavior on top of surfaces of polycrystalline silicon carbide SiC. The mechanism of melt-polycrystalline SiC interaction was found and reported. Non-wetting metal in a liquid phase penetrates into the micro and macro volumes in the polycrystalline SiC surface and holds there due to the residual stresses originated by the difference in the linear expansion coefficients. Metal layers obtained on the poly-crystalline SiC surfaces by the described method were durable and stable.

اللغة الأصليةالإنجليزيّة
عنوان منشور المضيف2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings
ناشرIEEE Computer Society
الصفحات334-337
عدد الصفحات4
رقم المعيار الدولي للكتب (المطبوع)1424401178, 9781424401178
المعرِّفات الرقمية للأشياء
حالة النشرنُشِر - 2006
منشور خارجيًانعم
الحدث2006 25th International Conference on Microelectronics, MIEL 2006 - Belgrade, صربيا
المدة: ١٤ مايو ٢٠٠٦١٧ مايو ٢٠٠٦

سلسلة المنشورات

الاسم2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings

!!Conference

!!Conference2006 25th International Conference on Microelectronics, MIEL 2006
الدولة/الإقليمصربيا
المدينةBelgrade
المدة١٤/٠٥/٠٦١٧/٠٥/٠٦

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