Effect of the plasma cleaning process on plastic ball grid array package assembly reliability

Keyphrases

• Adhesion Strength 10%
• Assembly Reliability 100%
• Ball Grid Array Package 100%
• Bonding Wire 10%
• C-mode 10%
• Cleaning Methods 100%
• Contact Angle Measurement 10%
• Cyclic Load 10%
• Die-attach 10%
• Encapsulation Techniques 10%
• Failure Mechanism 10%
• Hydrothermal Stress 10%
• Interface Adhesion Strength 10%
• Interface Delamination 30%
• Interface Material 10%
• Loading Conditions 10%
• Major Failure 10%
• Microelectronics Packaging 10%
• Microwave Energy 10%
• Moisture 10%
• Moisture Condition 10%
• Package Qualification 10%
• PBGA Package 10%
• Peel Test 10%
• Plasma Cleaning 100%
• Plasma System 20%
• Plastic Ball Grid Array 100%
• Process Productivity 10%
• Process Yield 10%
• Processed Material 10%
• Pull Strength 10%
• Pull Test 20%
• Qualification Level 10%
• Radiofrequency Energy 10%
• Reflow Process 10%
• Scanning Electron Microscopy 10%
• Shear Test 10%
• Soldering 10%
• Strength Degradation 10%
• Surface Contact Angle 10%
• Temperature Conditions 10%
• Vapor Pressure 10%
• Wire Bonding Process 10%
• Wire Pull Test 10%

Engineering

• Ball Grid Arrays 100%
• Bonding Process 33%
• Bonding Wire 33%
• Contact Angle Measurement 33%
• Cyclic Loads 33%
• Delamination 100%
• Experimental Result 33%
• Failure Mechanism 33%
• Major Failure 33%
• Material Interface 33%
• Microelectronics 33%
• Peel Test 33%
• Plasma System 66%
• Process Parameter 33%
• Process Yield 33%
• Pull Strength 33%
• Pull Test 66%
• Radio Frequency 33%
• Strength Degradation 33%
• Test Vehicle 33%