Design optimization of laser-induced microbridges for low resistance interline connections in ICs

In this work, we present a two-dimensional finite element (FE) model for laser beam-induced low-resistance lateral interconnects. We refer to these links as "Microbridges". The model allowed designers using different geometric parameters (interline spacing and the width-to-height ratio of metal lines) and metal-dielectric combination (Al/SiO₂) to optimize the design structure. The results of the FE analysis are consistent with the experimental results. An optimal design diagram for the Al/SiO₂ system is created to provide the best dimensional combinations exhibiting the widest process window and the best production yield.