Assessment of acceleration models used for BGA solder joint reliability studies

Keyphrases

• Reliability Study 100%
• Solder Joint 100%
• Solder Joint Reliability 100%
• Acceleration Model 100%
• BGA Solder Joint 100%
• Solder Joint Fatigue Life 40%
• Package Structure 40%
• Temperature Effect 20%
• Temperature Range 20%
• Shock Conditions 20%
• Electronic Packaging 20%
• Failure Data 20%
• Model Form 20%
• Maximum Temperature 20%
• Reliability Performance 20%
• Electronics Reliability 20%
• Thermal Shock 20%
• Life Model 20%
• Fatigue Life 20%
• Development Time 20%
• Life Performance 20%
• Development Cost 20%
• Added Cost 20%
• Norris-Landzberg Model 20%
• Joint Microstructure 20%
• Cycle Frequency 20%
• Ramp Rate 20%
• Joint Material 20%
• Engineering Approach 20%
• Reliability Engineering 20%
• Package Materials 20%
• Use Conditions 20%
• Joint Lives 20%
• Solder Interconnect 20%

Material Science

• Solder Joint 100%
• Fatigue of Materials 33%
• Thermal Shock 11%

Engineering

• Reliability Engineering 11%