A unified SPICE compatible model for large and small signal envelope simulation of linear circuits excited by modulated signals

Simon Lineykin, Sam Ben-Yaakov

نتاج البحث: نشر في مجلةمقالة من مؤنمرمراجعة النظراء

17 اقتباسات (Scopus)

ملخص

The envelope simulation method, developed earlier for large signal simulation (time domain, TRAN), is extended to include small signal envelope simulation (AC) and DC Sweep simulation (steady state for a range of carrier frequencies). The model is derived for AM, FM and PM modulation schemes and is demonstrated on a piezoelectric transformer circuit. The analytical derivations of the model were verified against full circuit simulations that include the high frequency carrier. Excellent agreement was found between the simulation results according to the new unified envelope model and the full simulation.

اللغة الأصليةالإنجليزيّة
الصفحات (من إلى)1205-1209
عدد الصفحات5
دوريةPESC Record - IEEE Annual Power Electronics Specialists Conference
مستوى الصوت3
حالة النشرنُشِر - 2003
منشور خارجيًانعم
الحدث2003 IEEE 34th Annual Power Electronics Specialists Conference - Acapulco, NM, الولايات المتّحدة
المدة: ١٥ يونيو ٢٠٠٣١٩ يونيو ٢٠٠٣

بصمة

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