TY - GEN
T1 - A New High-Volume/Low-Mix Simulation Testbed for Semiconductor Manufacturing
AU - Hassoun, Michael
AU - Kopp, Denny
AU - Monch, Lars
AU - Kalir, Adar
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/12
Y1 - 2019/12
N2 - As part of an effort to present to the semiconductor manufacturing community an updated wafer fab testbed, we provide the first of two simulation models, namely a High-Volume/Low-Mix (HV/LM) fab simulation model. The model is realistic in scale and level of complexity. A full description of the model features is provided, and its performance is studied based on an implementation using the AutoSched AP simulation tool. The simulation model is made publicly available online to allow researchers as well as practitioners to gain hands-on experience with it, and hopefully validate its features, or propose changes if needed. A final version of the testbed, including a low-volume/high-mix wafer fab simulation model will be presented within a year.
AB - As part of an effort to present to the semiconductor manufacturing community an updated wafer fab testbed, we provide the first of two simulation models, namely a High-Volume/Low-Mix (HV/LM) fab simulation model. The model is realistic in scale and level of complexity. A full description of the model features is provided, and its performance is studied based on an implementation using the AutoSched AP simulation tool. The simulation model is made publicly available online to allow researchers as well as practitioners to gain hands-on experience with it, and hopefully validate its features, or propose changes if needed. A final version of the testbed, including a low-volume/high-mix wafer fab simulation model will be presented within a year.
UR - https://www.scopus.com/pages/publications/85081127151
U2 - 10.1109/WSC40007.2019.9004654
DO - 10.1109/WSC40007.2019.9004654
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AN - SCOPUS:85081127151
T3 - Proceedings - Winter Simulation Conference
SP - 2419
EP - 2428
BT - 2019 Winter Simulation Conference, WSC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 Winter Simulation Conference, WSC 2019
Y2 - 8 December 2019 through 11 December 2019
ER -